H.R. 5422 · 112th Congress
To extend the temporary suspension of duty on epoxy molding compounds, of a kind used for encapsulating integrated circuits.
- Stage
- In committee
- Sponsor
- Mike Honda
- Introduced
- 2012-05-07
- Latest action
- 2012-05-14 · Referred to the Subcommittee on Trade.
Cosponsors (0)
No cosponsors are available.